CMP例句
9144590
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2024年06月19日 09:47:51The CMP process is also used to control film thickness and removal of barrier layers.
CMP技术也用于控制薄膜厚度及剥离隔离层.
Mathematical models were developed to simulate particle reduction in CMP slurry distribution systems.
为模拟cmp磨料 分配系统的粒子减少开发了数字模型.
Recent investigation shows that CeC & gt ; 2 nanoparticles can be used as CMP slurry to polish IC chip.
最新研究表明,纳米 CeO _2可用于集成电路芯片加工的化学机械抛光(CMP)浆料.
CMP技术也用于控制薄膜厚度及剥离隔离层.
Mathematical models were developed to simulate particle reduction in CMP slurry distribution systems.
为模拟cmp磨料 分配系统的粒子减少开发了数字模型.
Recent investigation shows that CeC & gt ; 2 nanoparticles can be used as CMP slurry to polish IC chip.
最新研究表明,纳米 CeO _2可用于集成电路芯片加工的化学机械抛光(CMP)浆料.
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